Fluid · Electronics Cooling
2D Turbulence Modeling (RANS/LES) for Electronics Cooling
Apply the 2d turbulence modeling (rans/les) to real electronics cooling problems — in the browser, with AI assistance.
This is the 2d variant of the Turbulence Modeling (RANS/LES). RANS averages the flow and models turbulence, while LES resolves large eddies and models the small ones — trading cost for fidelity.
In electronics cooling, teams face challenges like hotspot mitigation, fan/heatsink design, acoustic noise. The 2d turbulence modeling (rans/les) directly supports use cases such as heatsink cfd, fan curve modeling, thermal fea, and PolySim's AI Copilot can recommend settings and catch common setup errors before you run.
Typical Electronics Cooling use cases
- Heatsink CFD
- Fan curve modeling
- Thermal FEA
Upgrade your workspace
Compute Mega Pack — $50
Best-value bulk compute: 6,000 Compute Tokens.
Recommended products
Surrogate Instant Preview
$14Build an AI surrogate model for near-instant parameter previews.
CFD Pro Pack
$39A professional computational-fluid-dynamics toolset and templates.
Grant / Publication Figure Package
$85Publication-ready figures and animations from your results.
Solver Method Recommendation Report
$4Describe your problem; get the recommended method and settings.
Live Monthly Office Hours
$9A live Q&A session with a simulation specialist.
Verified Researcher Badge
$19/yrAn annual verified-researcher badge on your public profile.